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Mobile Phone Main Board (High Density Inverter PCB)

Mobile Phone Main Board (High Density Inverter PCB)
company All-electronics-online.com Co.,Ltd
Categories Other PCB & PCBA
Update2011-04-21
Original RegionChina
Mobile Phone Main Board (High Density Inverter PCB)
Specification: 8L(1+6+1)
Material: FR-4
Board thickness: 1.0mm
Final copper: 18um
Solder mask color: Green
Silkscreen: White(top)
Surface Finish: Immersion Gold + OSP(e. g. Entek)
Profile: Routing and stamp holes
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection

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